Electronic DivisionTechnical Capability for 2 ~ 6 layers PCB | 1 | Minimum copper track width (By dry film) | 0.12 mm | | 2 | Minimum gap between copper track / pad (By dry film) | 0.12 mm | | 3 | Copper track width etching accuracy | +/- 0.05 mm | | 4 | Printed copper pad location accuracy | +/- 0.08 mm | | 5 | Copper pad to pad location accuracy | +/- 0.08 mm | | 6 | Solder resist opening registration accuracy | +/- 0.05 mm | | 7 | Minimum punched hole diameter (1.6 mm FR-4 base material) | 2.00 mm | | 8 | Minimum punched hole diameter (1.6 mm CEM-3 base material) | 0.75 mm | | 9 | Minimum workable base material thickness with UL approval | 0.8 mm | | 10 | Maximum workable base material thickness with UL approval | 3.2 mm | | 11 | Minimum surface copper thickness | 35 mm | | 12 | Maximum surface copper thickness | 100 mm | | 13 | CNC drilling smallest hole diameter | 0.30 mm | | 14 | Non plated through hole diameter tolerance | +/- 0.05 mm | | 15 | Plated through hole diameter tolerance | +/- 0.075 mm | | 16 | Electrical test maximum no. of points | 6144
| | 17 | Electrical test SMD pad pitch distance | 0.4 mm & above | | 18 | Maximum number of layers | 6 | | 19 | Layer to layer registration | +/- 0.125 mm | | 20 | Workable base material | CEM-3, FR-4 | | 21 | Type of finishing available :
a. Gold plating
b. O.S.P. (organic soldering preservative)
c. Hot air solder leveling | |
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